The book is a detailed review of how microelectronic substrates are diced and what type of dicing machines and dicing blades are used. A review of each application end product is covered in detail. The book covers all the important dicing saws technical accuracy specs to be monitored in order to meet the diced substrates quality specs. The other side of the review covers the dicing blades technologies of the different dicing blades matrices and geometries. The dicing blades review talks about the bond technology, the manufacturing processes of the different blade types, the quality control specs and how to monitor and measure them. The major applications used in the microelectronic industries are covered in detail. This section includes the dicing saw types, dicing parameters, mounting technics, coolant designs and others. The dicing blade options used per application are discussed in detail. Some unique and difficult applications require different singulation technologies which are also covered in this unique book. The dicing saws, the blade technology and the application review are covered with detailed sketches and photos.
This book title, The Art of Dicing Microelectronic Substrates, ISBN: 9798350942262, by Gideon Levinson, published by BookBaby (March 30, 2024) is available in paperback. Our minimum order quantity is 25 copies. All standard bulk book orders ship FREE in the continental USA and delivered in 4-10 business days.
Unlike Amazon and other retailers who may also offer The Art of Dicing Microelectronic Substrates books on their website, we specialize in large quantities and provide personal service, from trusted, experienced, friendly people in Portland, Oregon. We offer a Price Match Guarantee, and QuickQuote form, to make purchasing quick and easy.
Prefer to work with a human being when you order The Art of Dicing Microelectronic Substrates books in bulk? Our Book Specialists are standing by Monday-Friday 8-5 PST, ready to help!
